TechInsights Pixel Zoo

Image Sensors World

Recently, Techinsights published a number of pixel pictures from its reverse engineering reports.

Samsung S5K2P7SQ ISOCELL Fast 16MP 30fps sensor with 1.12um pixel:

Sony IMX307 STARVIS 2.1MP sensor with 2.9um pixels:

Sony IMX402 ToF sensor:

Sony IMX410 full-frame sensor from Sony A7 III mirrorless camera:

Sony IMX250MZR Global Shutter polarization-sensitive CIS with 3.45um pixels:

SmartSens SC130GS Global Shutter CIS:

SK Hynix Hi-1332 CIS from Huawei RNE-AL00 front-facing camera module:

SiOnyx XQE-1310 IR-enhanced sensor:

ON Semiconductor AR0521 5.1MP sensor with 2.2um pixels:

OmniVision OS05A20 (OMN-OSE523) 5MP IR-enhanced Nyxel sensor with 2um pixels:

Sony 12 MP CIS from iPhone XS Max Rear-Facing Wide-Angle Camera:

Image Sensors World


No Comments

Leave a Reply

Your e-mail address will not be published. Required fields are marked *

Image Sensors World
Macquarie Research on Smartphone Camera Trends

IFNews quotes Macquarie Research “surveyed a total of 132 smartphones launched in 2019 by the top 6 vendors – Samsung, Huawei, Apple, OPPO / Realme, vivo and Xiaomi. There are 489 cameras in total or an average of 3.7 cameras per device, with 1.0 front camera and 2.7 back cameras. …

Image Sensors World
Goodix Nominated for Most Respected Public Semiconductor Company Award

Global Semiconductor Alliance (GSA) announces its 2019 award nominations with Goodix listed for Most Respected Public Semiconductor Company Achieving $ 500M to $ 1B in Annual Sales: Image Sensors World

Image Sensors World
Yole’s Analysis of Hybrid Bonding IP

Yole Developpement publishes “Hybrid Bonding: Patent Landscape Analysis” report: “Generally, 2.5D-3D stacking was achieved thanks to Through Silicon Via (TSV) technology. However, TSVs are large and using them limits efforts to reach very dense architectures. Furthermore, filling TSVs with metals is complex and requires significant know how. To overcome these …